Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/02/2016
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Application #:
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13739995
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Filing Dt:
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01/11/2013
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Inventor:
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Robert H. Smith
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Title:
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Panel For Enhancing Thermal Conduction In An Electronic Assembly
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 600 THIRD AVENUE |
| NEW YORK, NEW YORK 10016 |
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| KEN BURRASTON/L-3 COMMUNICATIONS KIRTON |
| 60 EAST SOUTH TEMPLE |
| SUITE 1800 |
| SALT LAKE CITY, UT 84111 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1025 W. NASA BLVD. |
| MELBOURNE, FLORIDA 32919 |
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| MITCH EVANDER |
| 1025 W. NASA BLVD. |
| MELBOURNE, FL 32919 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2150 S. CENTRAL EXPRESSWAY |
| SUITE 200 |
| MCKINNEY, TEXAS 75070 |
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| JOHN TUTUNJIAN |
| 401 BROADHOLLOW ROAD |
| SUITE 402 |
| MELVILLE, NY 11747 |
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