Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/08/2016
|
Application #:
|
14278006
|
Filing Dt:
|
05/15/2014
|
|
Publication #:
|
|
Pub Dt:
|
06/11/2015
| | | | |
|
Inventors:
|
Darryl J. Becker, William P. Hovis, Gerald K. Bartley, Philip R. Germann
|
|
Title:
|
INTELLIGENT CHIP PLACEMENT WITHIN A THREE-DIMENSIONAL CHIP STACK
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
|
|
|
|
| IBM CORP - ROCHESTER DRAFTING CENTER |
| 3605 HIGHWAY 52 NORTH |
| DEPT 917, BLDG 0061 |
| ROCHESTER, MN 55901 |
|
|
Search Results as of:
05/28/2024 07:49 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
