Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/15/2016
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Application #:
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14181814
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Filing Dt:
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02/17/2014
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Publication #:
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Pub Dt:
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08/20/2015
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Inventors:
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Shen-Nan Lee, Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien, Kuo-Yin Lin et al
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Title:
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WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT DEVICE MANUFACTURING PROCESSES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| ESCHWEILER & ASSOCIATES, LLC. |
| 629 EUCLID AVENUE, SUITE 1000 |
| NATIONAL CITY BANK BUILDING |
| CLEVELAND, OH 44114 |
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