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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/03/2016
Application #:
14228531
Filing Dt:
03/28/2014
Publication #:
Pub Dt:
10/01/2015
Inventors:
Zigmund R. Camacho, Bartholomew Liao, Sheila Marie L. Alvarez, HeeJo Chi, Kelvin Dao
Title:
Semiconductor Device and Method of Forming RDL and Vertical Interconnect by Laser Direct Structuring
Assignment: 1
Reel/Frame:
032551/0682Recorded: 03/28/2014Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/26/2014
Exec Dt:
03/26/2014
Exec Dt:
03/26/2014
Exec Dt:
03/28/2014
Exec Dt:
03/26/2014
Assignee:
10 ANG MO KIO STREET 65
#05-17/20 TECHPOINT
SINGAPORE, SINGAPORE 569059
Correspondent:
PATENT LAW GROUP: ATKINS & ASSOCIATES
55 N. ARIZONA PLACE
SUITE 104
CHANDLER, AZ 85225
Assignment: 2
Reel/Frame:
051365/0680Recorded: 12/18/2019Pages: 22
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/28/2019
Assignee:
NO. 500 LINJIANG ROAD
YUECHENG DISTRICT
SHAOXING, CHINA
Correspondent:
ROBERT D. ATKINS
123 W. CHANDLER HEIGHTS ROAD, #12535
CHANDLER, AZ 85248

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