Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/05/2016
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Application #:
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14282598
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Filing Dt:
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05/20/2014
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Inventors:
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In Sang Yoon, Sungmin Song, DeokKyung Yang
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED LASER VIA INTERPOSER AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| WONG & REES LLP |
| 4677 OLD IRONSIDES DRIVE |
| SUITE 370 |
| SANTA CLARA, CA 95054 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #04-08/09 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| WONG & REES LLP |
| 4677 OLD IRONSIDES DRIVE |
| SUITE 370 |
| SANTA CLARA, CA 95054 |
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