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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9412624
Issue Dt:
08/09/2016
Application #:
14316090
Filing Dt:
06/26/2014
Inventors:
Bartholomew Liao Chung Foh, Kyung Moon Kim, SeungYong Chai, Kwok Keung Szeto et al
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
Assignment: 1
Reel/Frame:
033628/0655Recorded: 08/28/2014Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CUONG, DAO NGUYEN PHU
Exec Dt:
08/04/2014
FOH, BARTHOLOMEW LIAO CHUNG
Exec Dt:
08/04/2014
DO, BYUNG TAI
Exec Dt:
07/29/2014
KIM, KYUNG MOON
Exec Dt:
07/11/2014
PUNZALAN, JEFFREY DAVID
Exec Dt:
07/29/2014
CHAI, SEUNGYONG
Exec Dt:
07/14/2014
LEE, SOO WON
Exec Dt:
07/27/2014
SZETO, KWOK KEUNG
Exec Dt:
07/29/2014
KIM, KYUNGOE
Exec Dt:
07/14/2014
Assignee:
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65
#05-17/20 TECHPOINT
SINGAPORE, SINGAPORE 569059
Correspondent:
ISHIMARU & ASSOCIATES LLP
2055 GATEWAY PLACE
SUITE 700
SAN JOSE, CA 95110
Assignment: 2
Reel/Frame:
039492/0890Recorded: 07/27/2016Pages: 5
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
STATS CHIPPAC LTD.
Exec Dt:
03/29/2016
Assignee:
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65
#05-17/20 TECHPOINT
SINGAPORE, SINGAPORE 569059
Correspondent:
WONG & REES LLP
4677 OLD IRONSIDES DRIVE
SUITE 370
SANTA CLARA, CA 95054

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