Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/08/2016
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Application #:
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13977183
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Filing Dt:
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06/28/2013
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Publication #:
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Pub Dt:
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10/24/2013
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PCT #:
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US1158598
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Inventors:
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John S. Guzek, Weng Hong Teh, Shan Zhong
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Title:
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A MULTI DIE PACKAGE HAVING A DIE AND A SPACER LAYER IN A RECESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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| BLAKELY SOKOLOFF TAYLOR & ZAFMAN |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3600 BRIDGE PARKWAY |
| SUITE 102 |
| REDWOOD CITY, CALIFORNIA 94065 |
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| WILSON SONSINI GOODRICH & ROSATI |
| 650 PAGE MILL ROAD |
| PALO ALTO, CA 94304 |
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