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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/22/2016
Application #:
12551755
Filing Dt:
09/01/2009
Publication #:
Pub Dt:
03/03/2011
Inventors:
John J. Garant, Robert G. Haas, Bouwe W. Leenstra, Phillip W. Palmatier
Title:
VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING
Assignment: 1
Reel/Frame:
023179/0857Recorded: 09/02/2009Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/01/2009
Exec Dt:
09/01/2009
Exec Dt:
09/01/2009
Exec Dt:
09/01/2009
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
INTERNATIONAL BUSINESS MACHINES CORPORAT
BLDG. 321-482
2070 ROUTE 52
HOPEWELL JUNCTION, NY 12533

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