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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9583179
Issue Dt:
02/28/2017
Application #:
14790510
Filing Dt:
07/02/2015
Publication #:
20150302919
Pub Dt:
10/22/2015
Inventors:
Yang Du, Jing Xie
Title:
THREE-DIMENSIONAL (3D) MEMORY CELL SEPARATION AMONG 3D INTEGRATED CIRCUIT (IC) TIERS, AND RELATED 3D INTEGRATED CIRCUITS (3DICS), 3DIC PROCESSOR CORES, AND METHODS
Assignment: 1
Reel/Frame:
036003/0700Recorded: 07/07/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
XIE, JING
Exec Dt:
07/09/2013
DU, YANG
Exec Dt:
07/09/2013
Assignee:
QUALCOMM INCORPORATED
100 REGENCY FOREST DRIVE
CARY, NORTH CAROLINA 27518
Correspondent:
W&T/QUALCOMM
100 REGENCY FOREST DRIVE
SUITE 160
CARY, NC 27518
Assignment: 2
Reel/Frame:
036046/0621Recorded: 07/09/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
XIE, JING
Exec Dt:
07/09/2013
DU, YANG
Exec Dt:
07/09/2013
Assignee:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121
Correspondent:
W&T/QUALCOMM
100 REGENCY FOREST DRIVE
SUITE 160
CARY, NC 27518

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