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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/23/2017
Application #:
14831151
Filing Dt:
08/20/2015
Publication #:
Pub Dt:
12/17/2015
Inventors:
Kirk D. Peterson, Keith C. Stevens, Mark A. DiRocco, Norman W. Robson
Title:
SIGNAL MONITORING OF THROUGH-WAFER VIAS USING A MULTI-LAYER INDUCTOR
Assignment: 1
Reel/Frame:
036383/0113Recorded: 08/20/2015Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/14/2013
Exec Dt:
12/03/2013
Exec Dt:
12/30/2013
Exec Dt:
12/05/2013
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
GIBB & RILEY, LLC
844 WEST STREET
SUITE 200
ANNAPOLIS, MD 21401

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