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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/28/2017
Application #:
14994976
Filing Dt:
01/13/2016
Publication #:
Pub Dt:
07/13/2017
Inventors:
Ivan Shubin, Xuezhe Zheng, Jin Hyoung Lee, Ashok V. Krishnamoorthy
Title:
HYBRID-INTEGRATED MULTI-CHIP MODULE
Assignment: 1
Reel/Frame:
037812/0015Recorded: 02/24/2016Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/12/2016
Exec Dt:
01/12/2016
Exec Dt:
01/12/2016
Exec Dt:
01/12/2016
Assignee:
500 ORACLE PARKWAY
M/S 50P7
REDWOOD CITY, CALIFORNIA 94065
Correspondent:
A. RICHARD PARK
PARK, VAUGHAN, FLEMING & DOWLER LLP
2820 FIFTH STREET
DAVIS, CA 95618

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