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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
11/28/2017
Application #:
15248687
Filing Dt:
08/26/2016
Publication #:
Pub Dt:
12/15/2016
Inventors:
Jin Young Kim, Yoon Joo Kim, Se Woong Cha, Ju Hoon Yoon, No Sun Park, Seung Jae Lee et al
Title:
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
Assignment: 1
Reel/Frame:
066221/0088Recorded: 01/08/2024Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/11/2013
Exec Dt:
11/12/2013
Exec Dt:
11/12/2013
Exec Dt:
11/13/2013
Exec Dt:
11/10/2013
Exec Dt:
11/13/2013
Exec Dt:
11/12/2013
Assignee:
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
MCANDREWS, HELD & MALLOY, LTD.
500 W. MADISON ST
34TH FLOOR
CHICAGO, IL 60661
Assignment: 2
Reel/Frame:
046683/0139Recorded: 08/01/2018Pages: 67
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/13/2018
Assignee:
333 SOUTH HOPE STREET
19TH FLOOR
LOS ANGELES, CALIFORNIA 90071
Correspondent:
MCGUIREWOODS LLP
1750 TYSONS BOULEVARD
SUITE 1800
TYSONS, VA 22102
Assignment: 3
Reel/Frame:
066380/0348Recorded: 01/30/2024Pages: 44
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/19/2019
Assignee:
491B RIVER VALLEY ROAD
VALLEY POINT #12/03
SINGAPORE, SINGAPORE 248373
Correspondent:
MCANDREWS, HELD & MALLOY, LTD.
500 W. MADISON ST
34TH FLOOR
CHICAGO, IL 60661

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