Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/22/2003
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Application #:
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09930011
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Filing Dt:
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08/14/2001
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Publication #:
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Pub Dt:
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01/03/2002
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Inventor:
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Eungjoon Park
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Title:
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TESTING DIES ON A SEMICONDUCTOR WAFER IN A SEQUENTIAL AND OVERLAPPING MANNER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3080 OLCOTT DRIVE, SUITE 130-D |
| SANTA CLARA, CALIFORNIA 95054 |
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| ROBERT J. IRVINE |
| 300 SOUTH WACKER SUITE 3100 |
| CHICAGO, IL 60606-6709 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2215-B RENAISSANCE DRIVE, SUITE 5 |
| LAS VEGAS, NEVADA 89119 |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| PATRICK R. JEWIK |
| TWO EMBARCADERO CENTER, EIGHTH FLOOR |
| SAN FRANCISCO, CALIFORNIA 94111-3834 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE RD |
| SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| FOLEY & LARDNER LLP |
| 150 EAST GILMAN ST. |
| VEREX PLAZA |
| MADISON, WI 53701-1497 |
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