Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10136260
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Filing Dt:
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05/01/2002
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Publication #:
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Pub Dt:
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11/07/2002
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Inventors:
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Jun-Ho Bae, Hong-Sik Byun
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Title:
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Cluster tool with vacuum wafer transfer module
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 49 NUNGPYONG-RI, OPO-UP, KWANGJU-SHI |
| KYONGGI-DO, 464-892, KOREA, REPUBLIC OF |
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| 707 DDONG, BOONDANG TECHNO PARK, 151 YATOP-DONG, BOONDANG-GU, SUNGNAM-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| 6-1205 IDANJI, SINDONG-A, APT. 272 BANGHAK 3-DONG, DOBONG-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| DUANE MORRIS LLP |
| LEWIS F. GOULD, JR., ESQ. |
| ONE LIBERTY PLACE |
| PHILADELPHIA, PA 19103-7396 |
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