Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/28/2003
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Application #:
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10108614
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Filing Dt:
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03/27/2002
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Publication #:
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Pub Dt:
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11/28/2002
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Inventors:
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Hui Wang, Peihaur Yih
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Title:
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ELECTROPOLISHING METAL LAYERS ON WAFERS HAVING TRENCHES OR VIAS WITH DUMMY STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SUITE 610 |
| 46520 FREMONT BLVD. |
| FREMONT, CALIFORNIA 94538 |
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| MORRISON & FOERSTER LLP |
| PETER J. YIM |
| 425 MARKET STREET |
| SAN FRANCISCO, CA 94105-2482 |
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