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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/30/2005
Application #:
10007304
Filing Dt:
12/05/2001
Publication #:
Pub Dt:
12/12/2002
Inventors:
Ki-Bum Kim, Pekka J. Soininen, Ivo Raaijmakers
Title:
COPPER INTERCONNECT STRUCTURE HAVING STUFFED DIFFUSION BARRIER
Assignment: 1
Reel/Frame:
012874/0783Recorded: 05/10/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/28/2002
Exec Dt:
04/15/2002
Exec Dt:
04/22/2002
Assignee:
KUTOJANTIE 2B
ESPOO, FINLAND 02630
Correspondent:
KNOBBE, MARTENS, OLSON & BEAR, LLP
620 NEWPORT CENTER DRIVE
SIXTEENTH FLOOR
NEWPORT BEACH, CA 92660
Assignment: 2
Reel/Frame:
014852/0964Recorded: 12/23/2003Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/26/2003
Assignee:
JAN VAN EYCKLAAN 10, 3723 BC
BILTHOVEN, NETHERLANDS
Correspondent:
KNOBBE MARTENS OLSON & BEAR LLP
2040 MAIN STREET
FOURTEENTH FLOOR
IRVINE, CA 92614

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