Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09461065
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Filing Dt:
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12/14/1999
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Publication #:
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Pub Dt:
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04/10/2003
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Inventors:
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CHE-YU LI, THOMAS L. SLY, WEIMIN SHI
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Title:
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HIGH DENSITY, HIGH FREQUENCY MEMORY CHIP MODULES HAVING THERMAL MANAGEMENT STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 107 N. AURORA ST. |
| ITHACA, NEW YORK 14850 |
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| SALZMAN & LEVY |
| MARK LEVY |
| 19 CHENANGO ST. |
| BINGHAMTON, NY 13901 |
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