Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10020911
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Filing Dt:
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12/19/2001
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Publication #:
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Pub Dt:
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06/19/2003
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Inventors:
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Gilroy J. Vandentop, Jun-Fei Zheng
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Title:
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Electrical/optical integration scheme using direct copper bonding
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 58119 |
| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| KENYON & KENYON |
| B. DELANO JORDAN, ESQ. |
| 1500 K ST., NW, STE. 700 |
| WASHINGTON, DC 20005 |
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