Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/13/2005
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Application #:
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10051906
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Filing Dt:
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01/16/2002
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Publication #:
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Pub Dt:
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07/17/2003
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Inventors:
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Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen
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Title:
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METHOD OF FORMING A SOLDER BALL USING A THERMALLY STABLE RESINOUS PROTECTIVE LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 121 PARK AVENUE 3 |
| HSIN-CHU, TAIWAN R.O.C |
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| TUNG & ASSOCIATES |
| RANDY W. TUNG |
| 838 W. LONG LAKE ROAD |
| SUITE 120 |
| BLOOMFIELD HILLS, MICHIGAN 48302 |
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