Patent Assignment Abstract of Title
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Total Assignments:
5
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Patent #:
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Issue Dt:
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03/23/2004
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Application #:
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10078718
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Filing Dt:
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02/19/2002
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Publication #:
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Pub Dt:
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08/21/2003
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Inventors:
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Yong Kee Yeo, Navas O.K. Khan, Mahadevan K. Iyer
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Title:
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ENHANCED CHIP SCALE PACKAGE FOR WIRE BOND DIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11 SCIENCE PARK ROAD |
| SINGAPORE SCIENCE PARK |
| SINGAPORE, JAPAN 117685 |
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| COATS & BENNETT |
| LARRY L. COATS |
| 1400 CRESCENT GREEN, SUITE 300 |
| APEX, NC 27502 |
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Assignment:
2
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| GOSHEN CORPORATE PARK, 1345 ENTERPRISE DRIVE |
| WEST CHESTER, PENNSYLVANIA 19380 |
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| WEIL, GOTSHAL & MANGES,C/OTERESA HARINGS |
| 767 5TH AVENUE |
| NEW YORK, NY 10153 |
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Assignment:
3
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| 390 GREENWICH STREET |
| 1345 ENTERPRISE DRIVE |
| NEW YORK, NEW YORK 10013 |
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| TERESA HARINGS |
| WEIL, GOTSHAL & MANGES LLP |
| 767 5TH AVENUE |
| NEW YORK, NY 10153 |
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Assignment:
4
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| 901 MAIN STREET |
| 22ND FLOOR |
| DALLAS, TEXAS 75202 |
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| CATHRYN A. BERRYMAN |
| JENKENS & GILCHRIST, ET AL |
| SUITE 3700 |
| 1445 ROSS AVENUE |
| DALLAS, TX 75202 |
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Assignment:
5
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 333 SOUTH HOPE STREET |
| 19TH FLOOR |
| LOS ANGELES, CALIFORNIA 90071 |
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| MCGUIREWOODS LLP |
| 1750 TYSONS BOULEVARD |
| SUITE 1800 |
| TYSONS, VA 22102 |
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