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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10097328
Filing Dt:
03/15/2002
Publication #:
Pub Dt:
09/18/2003
Inventors:
Lawrence D. Wong, Jihperng Leu, Grant Kloster, Andrew Ott, Patrick Morrow
Title:
Method of making a semiconductor device using a damascene interconnect with a laminated dielectric
Assignment: 1
Reel/Frame:
012708/0770Recorded: 03/15/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/11/2002
Exec Dt:
03/11/2002
Exec Dt:
03/11/2002
Exec Dt:
03/11/2002
Exec Dt:
03/11/2002
Assignee:
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95052
Correspondent:
KENYON & KENYON
BARRY S. GOLDSMITH
1500 K STREET, N.W.
SUITE 700
WASHINGTON, D.C. 20005-1257

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