Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/02/2004
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Application #:
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10316088
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Filing Dt:
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12/11/2002
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Publication #:
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Pub Dt:
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09/25/2003
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Inventors:
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Tzer-Perng Chen, Chih-Sung Chang, Kuang-Neng Yang
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Title:
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METHOD FOR INTEGRATING COMPOUND SEMICONDUCTOR WITH SUBSTRATE OF HIGH THERMAL CONDUCTIVITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F, NO. 10, LI-HSIN RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| NIXON PEABODY LLP |
| DONALD R. STUDEBAKER |
| SUITE 800 |
| 8180 GREENSBORO DRIVE |
| MCLEAN, VA 22102 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 LI-HSIN 5TH RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. 300 |
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| DONALD R. STUDEBAKER |
| NIXON PEABODY LLP |
| SUITE 900 |
| 401 9TH STREET, N.W. |
| WASHINGTON, D.C. 20004-2128 |
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