Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10064062
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Filing Dt:
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06/06/2002
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Publication #:
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Pub Dt:
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10/30/2003
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Inventor:
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Chi-Hsing Hsu
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Title:
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Flip-chip die and flip-chip package substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F, NO. 533, CHUNG-CHENG RD., HSIN-TIEN CITY |
| TAIPEI HSIEN, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7 FLOOR-1, NO. 100 |
| ROOSEVELT ROAD, SECTION 2 |
| TAIPEI, TAIWAN 100 |
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