Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10632552
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Filing Dt:
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08/02/2003
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Publication #:
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Pub Dt:
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04/01/2004
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Inventor:
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Marcos Karnezos
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Title:
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Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 47400 KATO ROAD |
| FREMONT, CALIFORNIA 94538 |
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| HAYES & BEFFEL LLP |
| BILL KENNEDY |
| P.O. BOX 366 |
| HALF MOON BAY, CA 94019 |
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