Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/19/2004
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Application #:
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10291951
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Filing Dt:
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11/08/2002
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Publication #:
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Pub Dt:
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05/13/2004
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Inventors:
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David Dobuzinsky, Siddhartha Panda, Rolf Weis, Richard Wise
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Title:
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METHOD OF IMPROVING ETCH UNIFORMITY IN DEEP SILICON ETCHING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION |
| DARYL K. NEFF |
| 2070 ROUTE 52, DEPT.18G/BLDG. 300-342 |
| INTELLECTUAL PROPERTY LAW DEPT. |
| HOPEWELL JUNCTION, NY 12533-6531 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1730 NORTH FIRST STREET |
| SAN JOSE, CALIFORNIA 95112 |
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| IBM CORPORATION |
| DARYL K. NEFF |
| 2070 ROUTE 52, DEPT. 18G/BLDG. 300-482 |
| INTELLECTUAL PROPERTY LAW DEPT. |
| HOPEWELL JUNCTION, NY 12533-6531 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST. MARTIN-STR. 53 |
| 81669 MUNICH, GERMANY |
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| INFINEON TECHNOLOGIES NORTH AMERICA CORP |
| STANTON C. BRADEN |
| SIEMENS CORPORATION, IP DEPARTMENT |
| 186 WOOD AVENUE SOUTH |
| ISELIN, NJ 08830 |
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