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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/14/2006
Application #:
10837359
Filing Dt:
04/29/2004
Publication #:
Pub Dt:
11/11/2004
Inventors:
Wayne Glenn Renken, Earl M. Jensen, Roy Gordon, Brian Paquette, Mei H. Sun
Title:
INTEGRATED PROCESS CONDITION SENSING WAFER AND DATA ANALYSIS SYSTEM
Assignment: 1
Reel/Frame:
014867/0223Recorded: 07/19/2004Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/15/2004
Exec Dt:
06/16/2004
Exec Dt:
06/15/2004
Exec Dt:
06/15/2004
Exec Dt:
06/15/2004
Assignee:
47451 FREMONT BLVD.
FREMONT, CALIFORNIA 94538-6504
Correspondent:
PARSONS HSUE & DE RUNTZ LLP
GERALD P. PARSONS
655 MONTGOMERY STREET, SUITE 1800
SAN FRANCISCO, CA 94111

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