Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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12/12/2006
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Application #:
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10724133
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Filing Dt:
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12/01/2003
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Publication #:
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Pub Dt:
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01/20/2005
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Inventor:
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Joon Hyeon Lee
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Title:
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METHOD OF FORMING METAL LINE LAYER IN SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SAN 136-1, AMI-RI, BUBAL-UEP |
ICHON-SHI, KYUNGKI-DO, KOREA, REPUBLIC OF 467-860 |
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JACOBSON HOLMAN PLLC |
YOON S. HAM |
400 7TH STREET, N.W. |
WASHINGTON, D.C. 20004-2218 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1 HYANGJEONG-DONG, HEUNGDUK-GU, CHEONGJU-SI |
CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF 361-725 |
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BLAKELY , SOKOLOFF, TAYLOR & ZAFMAN LLP |
1279 OAKMEAD PARKWAY |
SUNNYVALE, CA 94085-4040 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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215 DAESIN-RO (HYANGJEONG-DONG), HEUNGDEOK-GU |
CHEONGJU-SI, CHUNGBUK, KOREA, REPUBLIC OF |
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HYUN KYU LEE |
SEED IP LAW GROUP LLP |
701 FIFTH AVENUE, SUITE 5400 |
SEATTLE, WA 98104 |
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Assignment:
4
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO |
CHEONGJU-SI, KOREA, REPUBLIC OF 28429 |
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NSIP LAW |
P.O. BOX 65745 |
WASHINGTON, DC 20035 |
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