Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10661248
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Filing Dt:
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09/12/2003
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Publication #:
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Pub Dt:
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03/17/2005
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Inventors:
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Lawrence John Varnerin III, Zhijian Lu, Qiang Wu
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Title:
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Wafer processing techniques with enhanced alignment
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1730 NORTH FIRST STREET |
| SAN JOSE, CALIFORNIA 95112 |
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| SIEMENS CORPORATION |
| SIGALLE BARNESS |
| INFINEON TECHNOLOGIES NORTH AMERICA CORP |
| 170 WOOD AVENUE SOUTH, 5TH FLOOR |
| ISELIN, NJ 08830 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| INFINEON TECHNOLOGY NORTH AMERICA CORP. |
| C/O SIEMENS CORPORATION |
| SIGALLE BARNESS |
| 170 WOOD AVENUE SOUTH, 5TH FLOOR |
| ISELIN, NJ 08830 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST.-MARTIN-STR. 53 |
| 81669 MUNCHEN, GERMANY |
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| INFINEON TECHNOLOGIES NORTH AMERICA CORP |
| HEATHER ROWLAND |
| IFNA CPC IC |
| 3000 CENTREGREEN WAY |
| CARY, NORTH CAROLINA 27513 |
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