Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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09/15/2009
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Application #:
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10882536
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Filing Dt:
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06/30/2004
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Publication #:
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Pub Dt:
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05/19/2005
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Inventor:
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Sang-Young Kim
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Title:
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TEST PATTERN FOR RELIABILITY MEASUREMENT OF COPPER INTERCONNECTION LINE HAVING MOISTURE WINDOW AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB |
| ICHON-SHI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF 467-86 |
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| BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP |
| 12400 WILSHIRE BOULEVARD |
| 7TH FLOOR |
| LOS ANGELES, CA 90025 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 HYANGJEONG-DONG, HEUNGDUK-GU, CHEONGJU-SI |
| CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF 361-725 |
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| BLAKELY , SOKOLOFF, TAYLOR & ZAFMAN LLP |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085-4040 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 215 DAESIN-RO (HYANGJEONG-DONG), HEUNGDEOK-GU |
| CHEONGJU-SI, CHUNGBUK, KOREA, REPUBLIC OF |
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| HYUN KYU LEE |
| SEED IP LAW GROUP LLP |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104 |
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Assignment:
4
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO |
| CHEONGJU-SI, KOREA, REPUBLIC OF 28429 |
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| NSIP LAW |
| P.O. BOX 65745 |
| WASHINGTON, DC 20035 |
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