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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10737906
Filing Dt:
12/18/2003
Publication #:
Pub Dt:
06/23/2005
Inventor:
Tzung-Lung Lee
Title:
Chip assembly with glue-strengthening holes
Assignment: 1
Reel/Frame:
014819/0822Recorded: 12/18/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/09/2003
Assignee:
2F, NO. 31, ALLEY 1, LANE 342, FU-TEH 1ST RD
HSI CHIH CITY, TAIPEI HSIEN, TAIWAN R.O.C.
Correspondent:
TROXELL LAW OFFICE PLLC
BRUCE H. TROXELL
5205 LEESBURG PIKE
SUITE 1404
FALLS CHURCH, VA 22041-3401
Assignment: 2
Reel/Frame:
015541/0245Recorded: 01/10/2005Pages: 16
Conveyance:
SECURITY AGREEMENT
Assignor:
Exec Dt:
01/07/2005
Assignee:
635 WAVERLEY STREET
PALO ALTO, CALIFORNIA 94301
Correspondent:
PERRY J. VISCOUNTY, ESQ.
650 TOWN CENTER DRIVE, SUITE 2000
COSTA MESA, CA 92626

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