Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10917543
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Filing Dt:
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08/12/2004
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Publication #:
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Pub Dt:
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10/27/2005
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Inventors:
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Kei-Wei Chen, Shih-Ho Lin, Chun-Chang Chen, Ching-Hwan Su, Yu-Ku Lin, Ying-Lang Wang et al
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Title:
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Novel ECP method for preventing the formation of voids and contamination in vias
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8. LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| TUNG & ASSOCIATES |
| RANDY W. TUNG |
| 838 W. LONG LAKE ROAD |
| SUITE 120 |
| BLOOMFIELD HILLS, MICHIGAN 48302 |
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