Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/03/2007
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Application #:
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10925796
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Filing Dt:
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08/24/2004
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Publication #:
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Pub Dt:
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03/02/2006
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Inventor:
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William M. Hiatt
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Title:
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PASS THROUGH VIA TECHNOLOGY FOR USE DURING THE MANUFACTURE OF A SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83716 |
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| MICRON TECHNONOGY, INC. |
| KEVIN D MARTIN |
| 8000 S FEDERAL WAY |
| BOISE, ID 83716 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HWA-YA TECHNOLOGY PARK NO. 669, FUHSING 3 RD |
| KUEISHAN, TAOYUAN, TAIWAN |
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| DORSEY & WHITNEY LLP - IP DOCKET DEPT. |
| 701 FIFTH AVENUE |
| SUITE 6100 |
| SEATTLE, WA 98104-7043 |
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