Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10538801
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Filing Dt:
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06/13/2005
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Publication #:
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Pub Dt:
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03/16/2006
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Inventors:
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Jung_Il Byun, Kyung-Jun Lee, Jae-Yong Jung
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Title:
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Anisotropic-electroconductive adhesive, circuit connection method and structure using the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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19-20EF ASEM TOWER 159 SAMSUNG-DONG |
GANGNAM-GU, SEOUL 135-090, KOREA, REPUBLIC OF |
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JONES DAY |
222 EAST 41ST STREET |
NEW YORK, NY 10017 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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#159, SAMSEONG-DONG, GANGNAM-GU |
SEOUL, KOREA, REPUBLIC OF |
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JONES DAY |
222 EAST 41ST STREET |
NEW YORK CITY, NY 10017-6702 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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#1026-6 HOGYE-DONG, DONG-AN-GU, ANYANG-CITY |
GYEONGGI-DO, KOREA, REPUBLIC OF |
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JONES DAY |
222 EAST 41ST STREET |
NEW YORK CITY, NY 10017-6702 |
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05/28/2024 02:37 PM
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