Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10972377
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Filing Dt:
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10/26/2004
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Publication #:
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Pub Dt:
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04/27/2006
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Inventors:
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Jim Wang, Ben H. Chiang
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Title:
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Package structure of multi-chips light-emitting module
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 4, WENHUA RD., HSINCHU |
INDUSTRIAL PARK |
HUKOU SHIANG, TAIWAN 303, R.O.C. |
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ROSENBEG, KLEIN & LEE |
MORTON J. ROSENBEG, ESQ. |
3468 ELLICOTT CENTER DRIVE |
SUITE 101 |
ELLICOTT CITY, MD 21043 |
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