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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10971460
Filing Dt:
10/22/2004
Publication #:
Pub Dt:
05/11/2006
Inventors:
Su-Chen Fan, Hsueh-Chung Chen
Title:
Copper interconnect structure with modulated topography and method for forming the same
Assignment: 1
Reel/Frame:
015948/0948Recorded: 10/22/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/21/2004
Exec Dt:
10/21/2004
Assignee:
NO. 8, LI-HSIN ROAD 6
SCINECE BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
DUANE MORRIS LLP
HOWARD CHEN
ONE MARKET STREET
SPEAR TOWER, SUITE 2000
SAN FRANCISCO, CALIFORNIA 94105-1104

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