Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/27/2008
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Application #:
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11321574
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Filing Dt:
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12/29/2005
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Publication #:
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Pub Dt:
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05/18/2006
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Inventors:
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Xiaoyi Ding, John P. Schuster
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Title:
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WAFER-LEVEL SEALED MICRODEVICE HAVING TRENCH ISOLATION AND METHODS FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1303 E. ALGONQUIN |
| LAW DEPARTMENT IL01 - 3RD FLOOR |
| SCHAUMBURG, ILLINOIS 60196 |
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| MOTOROLA INC. |
| IL01-3RD FLOOR |
| 1303 E. ALGONQUIN ROAD |
| SCHAUMBURG, IL 60196 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21440 WEST LAKE COOK ROAD, 7TH FLOOR |
| PATENTS & LICENSES |
| DEER PARK, ILLINOIS 60010 |
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| CONTINENTAL AUTOMOTIVE SYSTEMS |
| TEMIC AUTOMOTIVE OF NORTH AMERICA, INC. |
| GARY J. CUNNINGHAM, PATENTS & LICENSES |
| 21440 WEST LAKE COOK ROAD, 7TH FLOOR |
| DEER PARK, IL 60010 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1 CONTINENTAL DR |
| AUBURN HILLS, MICHIGAN 48326-1581 |
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| CONTINENTAL AUTOMOTIVE SYSTEMS, INC. |
| 21440 W LAKE COOK RD |
| INTELLECTUAL PROPERTY |
| DEER PARK, IL 60010-3609 |
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