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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10906055
Filing Dt:
02/01/2005
Publication #:
Pub Dt:
08/03/2006
Inventors:
Hsin-Hui Lee, Mirng-Ji Lii, Chien-Hsiun Lee, Hsin-Yu Pan, Tsorng-Dih Yuan
Title:
Spacer Structures for Semiconductor Package Devices
Assignment: 1
Reel/Frame:
015630/0960Recorded: 02/01/2005Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/31/2005
Exec Dt:
01/31/2005
Exec Dt:
01/31/2005
Exec Dt:
01/31/2005
Exec Dt:
01/31/2005
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN
Correspondent:
BAKER & MCKENZIE
ON BEHALF OF TSMC
2300 TRAMMELL CROW CENTER
2001 ROSS AVENUE, SUITE 2300
DALLAS, TX 75201

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