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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
7544597
Issue Dt:
06/09/2009
Application #:
11332476
Filing Dt:
01/17/2006
Publication #:
20060180875
Pub Dt:
08/17/2006
Inventors:
Hee-Sook Park, Gil-Heyun Choi, Jang-Hee Lee, Chang-Won Lee, Byung-Hak Lee, Sun-Pil Youn et al
Title:
METHOD OF FORMING A SEMICONDUCTOR DEVICE INCLUDING AN OHMIC LAYER
Assignment: 1
Reel/Frame:
017836/0749Recorded: 04/28/2006Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PARK, HEE-SOOK
Exec Dt:
04/05/2006
CHOI, GIL-HEYUN
Exec Dt:
04/05/2006
LEE, CHANG-WON
Exec Dt:
04/05/2006
LEE, BYUNG-HAK
Exec Dt:
04/05/2006
YOUN, SUN-PIL
Exec Dt:
04/05/2006
LIM, DONG-CHAN
Exec Dt:
04/05/2006
PARK, JAE-HWA
Exec Dt:
04/05/2006
LEE, JANG-HEE
Exec Dt:
04/05/2006
SOHN, WOONG-HEE
Exec Dt:
04/05/2006
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
HARNESS, DICKEY PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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