Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/14/2006
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Application #:
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10907327
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Filing Dt:
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03/29/2005
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Publication #:
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Pub Dt:
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10/05/2006
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Inventors:
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Ching-Yu Ni, Tsorng-Dih Yuan, Hsin-Yu Pan
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Title:
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SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| BAKER & MCKENZIE |
| ON BEHALF OF TSMC |
| 2300 TRAMMELL CROW CENTER |
| 2001 ROSS AVENUE, SUITE 2300 |
| DALLAS, TX 75201 |
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