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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11126340
Filing Dt:
05/11/2005
Publication #:
Pub Dt:
11/16/2006
Inventor:
Chung Wu
Title:
Tightly engaged heat dissipating apparatus and method for manufacturing the same
Assignment: 1
Reel/Frame:
016553/0314Recorded: 05/11/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/31/2005
Assignee:
12D, NO. 123-1, HSING-DE RD.
SANCHUNG, TAIPEI, TAIWAN R.O.C.
Correspondent:
CHUN-MING SHIH
4331 STEVENS BATTLE LANE
FAIRFAX, VA 22033

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