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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7408257
Issue Dt:
08/05/2008
Application #:
11390220
Filing Dt:
03/28/2006
Publication #:
20060273444
Pub Dt:
12/07/2006
Inventors:
Kyu-dong Jung, Woon-bae Kim, In-sang Song, Moon-chul Lee, Jun-sik Hwang, Suk-jin Ham
Title:
PACKAGING CHIP AND PACKAGING METHOD THEREOF
Assignment: 1
Reel/Frame:
017748/0309Recorded: 03/30/2006Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHEN, LIANG-YUH
Exec Dt:
04/02/2002
WANG, YUCHUN
Exec Dt:
04/09/2002
WANG, YAN
Exec Dt:
04/05/2002
DUBOUST, ALAIN
Exec Dt:
04/03/2002
CARL, DANIEL A.
Exec Dt:
04/03/2002
WADENSWEILER, RALPH
Exec Dt:
04/05/2003
BIRANG, MANOOCHER
Exec Dt:
04/05/2002
BUTTERFIELD, PAUL D.
Exec Dt:
04/05/2002
MAVLIEV, RASHID
Exec Dt:
04/05/2002
TSAI, STAN D.
Exec Dt:
04/08/2002
Assignee:
APPLIED MATERIALS, INC.
P.O. BOX 450-A
PATENT COUNSEL
SANTA CLARA, CALIFORNIA 95052
Correspondent:
PATTERSON & SHERIDAN, L.L.P.
APPLIED MATERIALS INC.
3040 POST OAK BOULEVARD, SUITE 1500
HOUSTON, TX 77056
Assignment: 2
Reel/Frame:
017735/0335Recorded: 03/28/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
JUNG, KYU-DONG
Exec Dt:
03/21/2006
KIM, WOON-BAE
Exec Dt:
03/21/2006
SONG, IN-SANG
Exec Dt:
03/21/2006
LEE, MOON-CHUL
Exec Dt:
03/21/2006
HWANG, JUN-SIK
Exec Dt:
03/21/2006
HAM, SUK-JIN
Exec Dt:
03/21/2006
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG
YEONGTONG-GU, SUWON-SI
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037

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