Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11318875
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Filing Dt:
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12/28/2005
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Publication #:
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Pub Dt:
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06/28/2007
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Inventor:
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Feng Chen
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Title:
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Packaging method for an assembly of image-sensing chip and circuit board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7F, NO. 758, SEC. 4, BADE RD., SONGSHAN DISTRICT |
| TAIPEI CITY 105, TAIWAN R.O.C. |
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| MORTIN J. ROSENBERG, ESQ. |
| ROSENBERG, KLEIN & LEE |
| 3456 ELLICOTT CENTER DR |
| SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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