Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11614713
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Filing Dt:
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12/21/2006
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Publication #:
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Pub Dt:
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07/05/2007
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Inventor:
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Sang Chul Kim
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Title:
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METHOD OF FORMING COPPER INTERCONNECTIONS IN SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 891-10 DAECHI-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF 135-280 |
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| DANIEL H. SHERR |
| 620 HERNDON PARKWAY |
| SUITE 200 |
| HERNDON, VA 20170 |
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Assignment:
2
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PATENT SECURITY AGREEMENT
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| 2450 COLORADO AVE, SUITE 3000 WEST |
| SANTA MONICA, CALIFORNIA 90404 |
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| MORGAN, LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVE, NW |
| WASHINGTON, DC 20004 |
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