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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
05/24/2011
Application #:
11523895
Filing Dt:
09/19/2006
Publication #:
Pub Dt:
07/05/2007
Inventors:
Kenneth J. Huth, Lawrence C. Monterulo
Title:
METHOD FOR DEPOSITING SOLDER MATERIAL ON AN ELECTRONIC COMPONENT PART USING SEPARATORS
Assignment: 1
Reel/Frame:
022022/0538Recorded: 12/23/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/19/2008
Exec Dt:
12/03/2008
Assignee:
1 LABRIOLA COURT
ARMONK, NEW YORK 10504-1336
Correspondent:
DENISE E. JONES
1545 HOTEL CIRCLE SOUTH
SUITE 150
SAN DIEGO, CA 92108
Assignment: 2
Reel/Frame:
022162/0428Recorded: 01/28/2009Pages: 9
Conveyance:
SECURITY AGREEMENT
Assignor:
Exec Dt:
01/22/2009
Assignee:
111 SOUTH WACKER DRIVE
SUITE 5050
CHICAGO, ILLINOIS 60606
Correspondent:
SARAH ENDRES
C/O GOLDBERG KOHN, 55 E. MONROE ST.
STE. 3300
CHICAGO, IL 60603
Assignment: 3
Reel/Frame:
029014/0479Recorded: 09/24/2012Pages: 5
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/08/2012
Assignee:
1100 CASSATT ROAD
BERWYN, PENNSYLVANIA 19312
Correspondent:
DENISE E. JONES
2635 CAMINO DEL RIO SOUTH
SUITE 102
SAN DIEGO, CA 92108

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