Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11323444
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Filing Dt:
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12/30/2005
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Publication #:
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Pub Dt:
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07/05/2007
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Inventors:
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Kenneth J. Huth, Lawrence C. Monterulo, John C. Sugrue
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Title:
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Solder deposit method on electronic packages for post-connection process
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 LABRIOLA COURT |
| ARMONK, NEW YORK 10504 |
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| JOHN D. BUCHACA, ESQ. |
| CHARMASSON, BUCHACA & LEACH, LLP |
| 1545 HOTEL CIRCLE SOUTH, SUITE 150 |
| SAN DIEGO, CA 92108-3426 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 LABRIOLA COURT |
| ARMONK, NEW YORK 10504 |
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| JOHN D. BUCHACA, ESQ. |
| CHARMASSON, BUCHACA & LEACH, LLP |
| 1545 HOTEL CIRCLE SOUTH, SUITE 150 |
| SAN DIEGO, CA 92108-3426 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 LABRIOLA COURT |
| ARMONK, NEW YORK 10504 |
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| JOHN D. BUCHACA, ESQ. |
| CHARMASSON, BUCHACA & LEACH, LLP |
| 1545 HOTEL CIRCLE SOUTH, SUITE 150 |
| SAN DIEGO, CA 92108-3426 |
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Assignment:
4
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| 111 SOUTH WACKER DRIVE |
| SUITE 5050 |
| CHICAGO, ILLINOIS 60606 |
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| SARAH ENDRES |
| C/O GOLDBERG KOHN, 55 E. MONROE ST. |
| STE. 3300 |
| CHICAGO, IL 60603 |
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