Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11650103
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Filing Dt:
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01/05/2007
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Publication #:
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Pub Dt:
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07/12/2007
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Inventor:
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Chou Hsuan Tsai
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Title:
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Integrated circuit package having metallic members intruding into solder balls
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 270 PARK AVENUE |
| NEW YORK, NEW YORK 10036 |
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| GEORGE WANG |
| 1900 K STREET NW |
| SUITE 1200 |
| WASHINGTON, DC 20006 |
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