Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/14/2009
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Application #:
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11422730
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Filing Dt:
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06/07/2006
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Publication #:
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Pub Dt:
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12/13/2007
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Inventors:
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Eric S. Mindock, John R. Scott
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Title:
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ENCAPSULATED MULTI-PHASE ELECTRONICS HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100 N. RIVERSIDE PLAZA |
| CHICAGO, ILLINOIS 60606 |
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| BRADLEY K. LORTZ |
| 2540 HUNTINGTON DRIVE |
| SUITE 205 |
| SAN MARINO, CA 91108 |
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