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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11427380
Filing Dt:
06/29/2006
Publication #:
Pub Dt:
01/03/2008
Inventors:
Levi A. Campbell, Rehan Choudhary, Michael J. Ellsworth JR., Kenneth C. Marston et al
Title:
DIRECT LIQUID JET IMPINGEMENT MODULE FOR HIGH HEAT FLUX ELECTRONICS PACKAGES
Assignment: 1
Reel/Frame:
017874/0364Recorded: 06/29/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/27/2006
Exec Dt:
06/27/2006
Exec Dt:
06/27/2006
Exec Dt:
06/27/2006
Exec Dt:
06/27/2006
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
LILY NEFF
IBM CORPORATION - P386
INTELLECTUAL PROPERTY LAW
2455 SOUTH ROAD,
POUGHKEEPSIE, NEW YORK 12601

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