Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/14/2008
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Application #:
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11768281
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Filing Dt:
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06/26/2007
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Publication #:
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Pub Dt:
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01/24/2008
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Inventors:
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Chia-Sheng CHEN, Chih-Peng Laio
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Title:
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HEAT-DISSIPATING ASSEMBLY OF COMPUTER HOUSING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9 F., NO. 786, CHUNG-CHENG RD., |
| CHUNG-HO CITY, TAIPEI HSIEN, TAIWAN 235 |
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| HDLS PATENT & TRADEMARK SERVICE |
| 4331 STEVENS BATTLE LANE |
| FAIRFAX, VA 22033 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR PREVIOUSLY RECORDED ON REEL 019478 FRAME 0596. ASSIGNOR(S) HEREBY CONFIRMS THE IN ORIGINAL ASSIGNMENT, WE MISS THIS ASSIGNOR..
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| 9 F., NO. 786, CHUNG-CHENG RD., |
| CHUNG-HO CITY, TAIPEI HSIEN, TAIWAN 22033 |
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| HDLS PATENT & TRADEMARK SERVICE |
| 4331 STEVENS BATTLE LANE |
| FAIRFAX, VA 22033 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 160 GREENTREE DRIVE, SUITE 101 |
| DOVER, DELAWARE 19904 |
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| TUROCY & WATSON, LLP |
| 127 PUBLIC SQUARE |
| 57TH FLOOR, KEY TOWER |
| CLEVELAND, OH 44114 |
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