Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11800996
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Filing Dt:
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05/08/2007
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Publication #:
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Pub Dt:
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03/20/2008
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Inventors:
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Jae-hwa Park, Gil-heyun Choi, Jong-myeong Lee, Hee-sook Park
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Title:
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Methods of forming metal wiring layers for semiconductor devices
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| SCOTT C. HATFIELD |
| MYERS BIGEL SIBLEY & SAJOVEC |
| P.O. BOX 37428 |
| RALEIGH, NC 27627 |
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